CDIL Semiconductors (Continental Device India) has announced the addition of new semiconductor packaging lines through the IT ministry's SPECS scheme, with the goal of increasing manufacturing capacity by 100 million units with the new lines. According to a press release, the company has begun the first phase of this production with a surface-mount packaging line capable of producing 50 million devices, which will be inaugurated on September 28 by Minister of State for Electronics and IT Rajeev Chandrasekhar.

"CDIL Semiconductors (Continental Device India)...will add new semiconductor packaging lines through the Government of India and MeitY's SPECS scheme," the company announced.

The new lines are expected to increase CDIL's annual capacity by 100 million units, according to the release. CDIL is a global provider of semiconductor and electronics services to customers in the consumer, industrial, defence, aerospace, and automotive industries.

According to the release, the company has long-term customers in the United States, United Kingdom, Germany, China, Hong Kong, Japan, South Korea, South Africa, and Egypt.